EES Seminar-How Robotic Disassembly is Reforming the E-Waste Recycling Industry, D. Wang, Toyoshima Green Tech

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Abstract: This seminar introduces the significant potential of robotic disassembly in the electronic waste (e-waste) recycling industry. It discusses the limitations of traditional recycling methods, such as landfilling, shredding, and manual disassembly, and introduces robotics as a solution for improving productivity, reducing environmental harm, and maximizing material recovery. Main topics include the role of AI in advancing robotic precision, the economic and environmental benefits of advanced recycling technologies, and the potential to preserve valuable resources such as metals and chips within domestic markets. The seminar will also describe how robotic systems address practical challenges, including the secure handling of data from devices such as routers and hard drives, economic-viable chip harvesting and refurbishing, and the reduction of carbon emissions by improving material sorting and reuse. It describes how these advancements create economic opportunities by keeping valuable resources and profits within domestic markets and mitigating the environmental and social issues of exporting e-waste. Specific examples, such as the disassembly of Chromebooks and routers, will show the practical applications of the robotic solutions.

Bio: Dan Wang is a seasoned executive and innovative leader in the electronics and sustainability industries. With over 25 years of experience in manufacturing and operations, he has spearheaded advancements in capacitor technology and sustainable production practices. Currently, he serves as the CEO of Toyoshima Green Tech Inc., a company he founded in 2017, which develops green technology solutions, including chip refurbishment and robotic disassembly lines for routers and Chromebooks. Under his leadership, the company has achieved certifications from prominent organizations such as Wistron, Esco, and SMS Infocom.
Mr. Wang has a degree in Business Administration and began his career at CAMEL Technology Inc., where he rose through the ranks to lead operations in Shanghai and Dongguan. He was instrumental in securing vendor certifications from global giants such as Schneider, Hitachi Media, and Foxconn. His visionary approach drove significant technological transformations, such as the shift from through-hole to surface-mount chip capacitors and the introduction of polymer-based dielectric capacitors. He has been recognized with awards, including Schneider’s Best Supplier of Electronic Components.